Anyone who has worked in a production workshop has had some contact with inspection equipment, especially those in IPQC or similar positions. They've encountered various types of inspection equipment, such as manual visual inspection and AOI (Automated Optical Inspection). 2D X-ray inspection equipment uses X-rays to penetrate the interior of a product and visualize its internal structure. However, this type of equipment is relatively outdated, and its inspection range is limited. It can generally detect broken or disconnected gold or copper wires within integrated circuits (ICs), broken circuit boards, short circuits in BGA or LGA solder joints, and the presence of bubbles and other defects.
However, 2D X-ray inspection equipment has limitations when it comes to defects such as HIP (Hardware Injection) and NWO (Non-Waste Metal).