Non-destructive Testing: AXI can inspect the internal structure of products without damaging them, ensuring product integrity.
Short Circuit Location: AXI technology can detect short circuits on BGAs, CSPs, QFNs, and flip chips.
Solder Joint Void Detection: Applicable to solder joint inspection, including BGAs, CSPs, QFNs, QFPs, and flip chips.
Component Displacement Detection: Accurately detects component displacement issues that may occur during production.
Semiconductor Inspection: Includes detailed inspection of bonding wires, chip alignment, etc.
Automotive Component Inspection: Such as inspection of switches, relays, and contacts, as well as plugs, crimps, and cable connections.
Prototype Testing: Prototype testing is performed before mass production to avoid unnecessary manufacturing costs.
Process Parameter Optimization: Based on inspection results, production processes are adjusted to improve production efficiency and product yield.
Sampling Analysis: Random sampling inspection of products ensures consistent product quality.