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High-speed X-ray Inspection System

High-speed X-ray Inspection System

AXI-S700 is an inline 3D high-speed X-ray inspection system engineered for high-efficiency quality control. Boasting a high-performance X-ray source and advanced high-speed scanning architecture, it delivers micron-level precision imaging and end-to-end automated inspection capabilities. Equipped with cutting-edge 3D reconstruction algorithms, the system rapidly acquires high-accuracy 3D data, enabling clear visualization of internal structures of inspected components and precise identification of micro-defects.

Introduction:

 

AXI-S700 is an inline 3D high-speed X-ray inspection system engineered for high-efficiency quality control. Boasting a high-performance X-ray source and advanced high-speed scanning architecture, it delivers micron-level precision imaging and end-to-end automated inspection capabilities. Equipped with cutting-edge 3D reconstruction algorithms, the system rapidly acquires high-accuracy 3D data, enabling clear visualization of internal structures of inspected components and precise identification of micro-defects.

Optimized for high-volume production environments, it meets inline quality inspection demands with ultra-high throughput. While ensuring exceptional inspection precision and operational stability, it significantly enhances production efficiency-providing a high-performance, reliable non-destructive testing (NDT) solution tailored to electronic manufacturing, semiconductor, and other high-tech industries.

 

S700

 

Product Features

 

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In-Line 3D

High-speed, high-precision online Inspection

 

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360°Planar Reconstruction

With the help of planar CT imaging technology using horizontal full-circumference circular projection, it is possible to achieve all-round, blind-spot-free planar tomographic scanning and high-definition imaging of the target being detected

 

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Multi-Mode Selection

Equipped with multi-mode selection and a flexible modular design architecture, it can achieve rapid functional expansion and customized development according to the inspection scenarios and needs of different industrial products.

 

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Multi-Resolution

Equipped with flexible multi-resolution adjustment, the standard resolution covers the range of 10μm–30μm, and a 5μm ultra-high precision mode can be selected as needed, easily adapting to the fine inspection requirements of different industrial products.

 

 

Core Technology

 

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Technical Specifications

 

Machine Type

AXI-S700

AXI-S700HP

X-Ray Tube

Type

Closed Microfocus X-Ray Tube

Maximum Tube Voltage

130kV

150kV

Maximum Tube Current

300μA

500μA

Power

39W

75W

Imaging System

Detector Types

High-Definition CMOS Flat Panel Detector

Image Resolution

(Standard Machine)

10-20μm(5μm Optional)

20-40μm

Image depth

16bit

Inspection Object & Motion Method

Max. Inspection Area

(mm)

600x510

 

Max. Load Capacity

5kg

20kg

Motion Control Mode

Linear Motor + Linear Encoder

CT Mode

Horizontal 360°Circular Projection (Planar CT)

Machine Parameters

Max. Power Consumption

≤3.7kW

≤4.0kW

Machine Dimensions(mm)

1645x2075x1800(WxDxH)

Weight

≈ 3700kg

≈ 3750kg

Safety

Radiation Leakage

≤ 0.5μSv/h

 

 

Inspection Image

 

DBCCHIP

 

After-sales Service

Fast Response Mechanism

We offer 24/7 hotline and online technical support. In the event of equipment malfunctions, our engineers will respond within 1 hour and provide solutions within 24 hours (specific commitments subject to regional availability).

 

Original Factory Warranty & Regular Maintenance

Comprehensive original factory warranty services are provided. Upon expiration of the warranty period, customers shall bear the relevant costs for spare parts replacement and maintenance.

 

Software Upgrades & Lifecycle Support

We continuously deliver functional upgrade services for equipment software and commit to providing long-term technical and lifecycle support for sold equipment.

 

 

About Us and Factory

 

Rich experience in the R&D of core hardware and software technologies for CT systems.

Our team has long been dedicated to the R&D of core hardware and software technologies for CT systems, while advancing the application of artificial intelligence (AI) in industrial sectors. Focusing on high-value precision non-destructive testing (NDT) using X-ray technology in the pan-semiconductor industry, we have independently developed an industrial CT 3D reconstruction and intelligent inspection hardware-software platform, and launched standardized inline 3D AXI products. Serving industrial fields, including electronic circuits, pan-semiconductors, and consumer electronics, Empowering enterprises to address non-destructive inspection challenges in high-speed production line.

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