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3D SMT X-ray Inspection System

3D SMT X-ray Inspection System

AXI-S700 Inline 3D SMT X-RAY Inspection System empowers high-precision quality control in electronic manufacturing, seamlessly adapting to high-precision inspection scenarios for SMT components such as PCBs, chip packages, and BGA/CSP.

Introduction:

 

AXI-S700 Inline 3D SMT X-RAY Inspection System empowers high-precision quality control in electronic manufacturing, seamlessly adapting to high-precision inspection scenarios for SMT components such as PCBs, chip packages, and BGA/CSP. Equipped with a high-performance X-ray source, high-resolution imaging system, and advanced 3D reconstruction algorithms, it penetrates component surfaces to enable 3D visualization of internal structures, accurately detecting hidden defects including cold solder joints, bridging, voids, chip misalignment, and pin deformation with micron-level precision.

Supporting end-to-end unmanned operation, the system integrates component positioning, high-speed scanning, data analysis, and report generation into a streamlined workflow. Optimized for high-volume SMT production rhythms, it significantly boosts production efficiency while ensuring reliable non-destructive quality control. This high-performance solution empowers electronic manufacturing enterprises to enhance product yield and core competitiveness.

 

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Product Features

 

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In-Line 3D

High-Speed Automatic In-Line Inspection

 

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360°Planar Reconstruction

Horizontal 360°Circular Projection (Planar CT)

 

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Multi-Mode Selection

Modular Design; Support Functional Expansion & Custom Developmen

 

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Multi-Resolution

10μm–30μm (5μm Optional)

 

 

Core Technology

 

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Technical Specifications

 

Machine Type

AXI-S700

AXI-S700HP

X-Ray Tube

Type

Closed Microfocus X-Ray Tube

Maximum Tube Voltage

130kV

150kV

Maximum Tube Current

300μA

500μA

Power

39W

75W

Imaging System

Detector Types

High-Definition CMOS Flat Panel Detector

Image Resolution

(Standard Machine)

10-20μm(5μm Optional)

20-40μm

Image depth

16bit

Inspection Object & Motion Method

Max. Inspection Area

(mm)

600x510

 

Max. Load Capacity

5kg

20kg

Motion Control Mode

Linear Motor + Linear Encoder

CT Mode

Horizontal 360°Circular Projection (Planar CT)

Machine Parameters

Max. Power Consumption

≤3.7kW

≤4.0kW

Machine Dimensions(mm)

1645x2075x1800(WxDxH)

Weight

≈ 3700kg

≈ 3750kg

Safety

Radiation Leakage

≤ 0.5μSv/h

 

 

Inspection Image

 

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After-sales Service

Fast Response Mechanism

We offer 24/7 hotline and online technical support. In the event of equipment malfunctions, our engineers will respond within 1 hour and provide solutions within 24 hours (specific commitments subject to regional availability).

 

Original Factory Warranty & Regular Maintenance

Comprehensive original factory warranty services are provided. Upon expiration of the warranty period, customers shall bear the relevant costs for spare parts replacement and maintenance.

 

Software Upgrades & Lifecycle Support

We continuously deliver functional upgrade services for equipment software and commit to providing long-term technical and lifecycle support for sold equipment.

 

 

About Us and Factory

 

Rich experience in the R&D of core hardware and software technologies for CT systems.

Our team has long been dedicated to the R&D of core hardware and software technologies for CT systems, while advancing the application of artificial intelligence (AI) in industrial sectors. Focusing on high-value precision non-destructive testing (NDT) using X-ray technology in the pan-semiconductor industry, we have independently developed an industrial CT 3D reconstruction and intelligent inspection hardware-software platform, and launched standardized inline 3D AXI products. Serving industrial fields, including electronic circuits, pan-semiconductors, and consumer electronics, Empowering enterprises to address non-destructive inspection challenges in high-speed production line.

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